21 Dec 2017

Innovative NVMe-oF storage solutions lowers development costs

Microsemi and American Megatrends, a specialist in BIOS and UEFI firmware, server and remote management tools, data storage products and unique solutions based on the Linux and Android operating systems; have announced their collaboration on the development of an NVM Express over Fabrics (NVMe-oF) reference architecture solution.

The innovative new solution incorporates AMI’s MegaRAC FP-X Fabric Management Firmware technology with Microsemi’s Switchtec PCIe switches on an Intel Rack Scale Design (Intel RSD) reference architecture.

Intel RSD caters to the specific needs of data center operators, with the ability to efficiently scale and lower operational costs via resource pooling and leverage excellent storage, networking and virtualization technologies. With resource pooling a key benefit of the Intel RSD architecture, Microsemi provides the fabric interconnect infrastructure with its high density, low power PCIe switches. The combination of technologies from these three companies provides essential building blocks for original equipment manufacturer (OEM) and original design manufacturer (ODM) customers in the hyperscale data center and enterprise markets.

“As Intel RSD and AMI’s MegaRAC software are widely adopted by major data center OEM, ODM and hyperscale customers, we are pleased our innovative Switchtec PCIe switches are an integral part of the RSD ecosystem,” said Pete Hazen, vice president and business unit manager of storage solutions at Microsemi. “Collaborating with AMI and Intel as part of Microsemi’s Accelerate Ecosystem Program supports our goal to deliver leading-edge, turnkey solutions for data center customers worldwide.”

The Intel RSD implementation can utilize NVMe-oF to manage pooled storage for increased performance and efficiency, including higher resource utilization and lower total cost of operation. Administrators can compose systems from pools of storage tiers to deliver workload-optimized systems for their end users. For example, an intensive input/output (I/O) workload such as Somatic MUtation FINder (SMuFin) running on multiple servers attached with individual local NVMe storage can now complete the same operation in the same running time on the RSD implementation with a disaggregated NVMe storage model. This can lower storage hardware costs by up to two-thirds. In addition to the key benefits of improved performance and resource utilization, the combined resources of Microsemi and AMI translate to direct regional support for customers on a global basis.

“Microsemi and AMI continue to be valuable collaborators in bringing OEM solutions based on Intel RSD to market,” said Figen Ulgen, general manager of Intel Rack Scale Design. “This latest collaboration on NVMe over Fabrics with Intel RSD will offer data center operators even greater business agility and efficiency.”

OEMs and ODMs can leverage the benefits of combining the AMI MegaRAC development framework with the enhancements from Intel RSD and Microsemi’s Switchtec PCIe switches to lower development costs and speed time to market. Microsemi’s dynamic switch partitioning technology, supported by Switchtec PCIe switches in combination with its Flashtec non-volatile random-access memory (NVRAM) cards and NVMe controllers, enables rapid deployment of NVMe-oF solutions, while significantly offloading central processing unit (CPU) utilization and practically eliminating system double date rate (DDR) bandwidth requirements. This leads to better overall throughput, latency and quality of service (QoS).

According to G2M Research’s “NVMe Ecosystem Market Sizing Report,” the NVMe market will be more than $60 billion by 2021.

“We are witnessing how NVMe-oF is quickly supplanting traditional methods of storage access. This, combined with the ability to quickly and easily compose and decompose pooled resources via Intel RSD, increases utilization therefore lowering total cost of operation,” said Subramonian Shankar, president, founder and CEO of American Megatrends. “As such, we are excited about the capabilities inherent in this combined AMI, Intel and Microsemi solution for the opportunity it represents to better serve new and existing OEM and ODM customers. We also look forward to even greater collaboration between Microsemi and AMI for a variety of product lines including PCIe switches, RAID technology and field programmable gate arrays (FPGAs).”

NVMe-oF solutions are ideally suited for the hyperscale data center and enterprise markets for NVMe storage pooling applications. The device will also be targeted at applications including extending pooling to other end points, such as FPGAs and general-purpose graphics processing units (GPGPUs).

The jointly developed NVMe-oF solution is available now through AMI and its distribution channels.

Most popular news in Processing & embedded

Collaboration provides customers with embedded emWin GUI software
Reduce driver distraction with 3D gesture recognition controller
SoC interconnect solution delivers on efficiency for next-gen AI SoCs
Arduino & MathWorks team up to offer students engineering kit
AI-powered design and integration platform accelerates SoC designs

All news in this channel | All news

Share this page

Want more like this? Register for our newsletter

The benefits of replacing plain old paper with e-paper displays in automotive assembly plants HD Lee | Pervasive Displays
The benefits of replacing plain old paper with e-paper displays in automotive assembly plants
Efficiency is at the heart of automation, and that is nowhere more apparent than in the manufacture of automobiles. The Ford Motor Company is widely credited with inventing the moving assembly line, but the concept of moving the assembly, rather than the worker, dates back centuries.

Radio-Electronics.com is operated and owned by Adrio Communications Ltd and edited by Ian Poole. All information is © Adrio Communications Ltd and may not be copied except for individual personal use. This includes copying material in whatever form into website pages. While every effort is made to ensure the accuracy of the information on Radio-Electronics.com, no liability is accepted for any consequences of using it. This site uses cookies. By using this site, these terms including the use of cookies are accepted. More explanation can be found in our Privacy Policy