23 Jul 2018

DSP creates internal and external engine sound for electric vehicles

Analog Devices has introduced an embedded system for generating engine sound for electric (EV) and hybrid electric vehicles (HEV). The ADSP-BF706 digital signal processor and Electric Vehicle Warning Sound System (EVWSS) firmware enables automobile manufacturers in North America and other global regions to comply with future safety regulations mandating external engine sound for EVs and HEVs travelling at low speeds.

The ADI solution includes a complete hardware and firmware reference design. It can be scaled for high performance with the ADSP-BF706 or entry level applications with the ADAU1450 Digital Audio Processor. The ADSP-BF706 can also be used to create in-cabin engine sound to contribute to an improved driving experience for vehicle owners. The ADSP-BF706 uses memory mapped quad SPI memory providing faster and simpler access to the stored audio files used to create the engine sound. It can access up to 24 WAV files simultaneously, compared to conventional products that can typically access only five.

ADI’s Sigma Studio Integrated Development Environment (IDE) enables OEMs to graphically tune the audio sound when using the ADAU1450. This allows sound engineers with minimal programming experience to optimize audio performance while reducing development time. A new release of Sigma Studio supporting the ADSP-BF706 is due later this year. In addition, a low-cost CAN software stack runs on the ADSP-BF706 to help customers quickly build automotive-grade prototypes.

ADSP-BF706 Product Highlights

Blackfin+ core with up to 400-MHz performance

  • Dual 16-bit or single 32-bit MAC support per cycle

  • 16-bit complex MAC and many other instruction set enhancements

  • Instruction set compatible with previous Blackfin products

On-Chip Memory

  • 136KB L1 SRAM with multi-parity-bit protection (64KB instruction, 64KB data, 8KB scratchpad)

  • 1MByte on-chip L2 SRAM with ECC protection

  • 512KByte On-chip L2 ROM

Key Peripherals include

  • USB2.0 HS OTG

  • 2x CAN2.0B

  • ePPI Video I/O

  • 2x SPORTs (w/I2S)

  • 2xQuad-SPI / 1xDual-SPI (w/ Host mode)

  • 12C

  • 2xUART

  • SD/SDIO/MMC (4-bit)

Most popular news in Processing & embedded

Wind River brings VxWorks safety portfolio to cutting-edge NXP platforms
Xilinx extends functional safety into AI-class devices
New microcontroller-based dual USB platform
Cadence Timing Signoff Tools enable MaxLinear's PAM4 success
BrainChip Studio 2018.3 improves facial classification accuracy

All news in this channel | All news


Share this page


Want more like this? Register for our newsletter






2019 Electronic Component Market Supply Forecast  Ian Poole | Electronics Notes
2019 Electronic Component Market Supply Forecast
Electronic supply has a major impact on manufacturers and as a result it is an aspect of the industry that many are keen to forecast and prepare for and changes in the industry.









Radio-Electronics.com is operated and owned by Adrio Communications Ltd and edited by Ian Poole. All information is © Adrio Communications Ltd and may not be copied except for individual personal use. This includes copying material in whatever form into website pages. While every effort is made to ensure the accuracy of the information on Radio-Electronics.com, no liability is accepted for any consequences of using it. This site uses cookies. By using this site, these terms including the use of cookies are accepted. More explanation can be found in our Privacy Policy