29 May 2018

Highest power density for 650V IGBT in surface mounting D2PAK

Infineon Technologies has expanded its product portfolio of the thin-wafer technology TRENCHSTOP5 IGBT. The new product family is offering up to 40 A 650V IGBT, co-packed with a full rated 40 A diode in a surface mounting TO-263-3 also known as D2PAK.

The new TRENCHSTOP 5 IGBT in D2PAK package serves the growing demand for higher power density in power devices for automated surface mounted assembly. Typical applications requiring highest power density and efficiency are solar inverters, uninterruptible power supply (UPS), battery charging, and energy storage.

The ultra-thin TRENCHSTOP 5 technology from Infineon allows higher power density in a smaller chip size. Thus, Infineon is the first to fit a 40 A 650V IGBT together with a 40 A diode in D2PAK housing. Compared to competing products in D2PAK, the new family offers a higher rating than any other product on the market, with other co-packed solutions delivering only 75 percent of the power.

The high power density of the new devices enables designers to upgrade existing designs, to develop new platforms with up to 25% higher power output or to reduce the quantity of power devices used in parallel and thus allowing more compact designs. The unique co-packed 40 A in D2PAK can be considered as an alternative to D3PAK or TO-247 used for surface mounting. This supports easy soldering, leading to fast and reliable assembly.

The new TRENCHSTOP 5 650V IGBTs in D2PAK are released for high volume production. The product family comprises 15 A, 20 A, 30 A single IGBT and 15 A, 20 A, 30 A and 40 A IGBT co-packed with the same current freewheeling diode.

Most popular news in Electronics components

Infineon and JD join efforts to build smart IoT ecosystem
Compound Semiconductor Applications Catapult ready for business
"Clock Tree on a Chip” offers innovative multi-profile support
Innovative connectors for rail
KSC PF switch offers reliable, water-resilient, potting-friendly solution

All news in this channel | All news


Share this page


Want more like this? Register for our newsletter






Object Recognition with 3D Time-of-Flight Cameras and Neural Networks Mark Patrick | Mouser Electronics
Object Recognition with 3D Time-of-Flight Cameras and Neural Networks
Machine vision - the ability for computers to see and recognise the world around us - is becoming more important for a variety of fields, from IoT and manufacturing through to augmented reality.









Radio-Electronics.com is operated and owned by Adrio Communications Ltd and edited by Ian Poole. All information is © Adrio Communications Ltd and may not be copied except for individual personal use. This includes copying material in whatever form into website pages. While every effort is made to ensure the accuracy of the information on Radio-Electronics.com, no liability is accepted for any consequences of using it. This site uses cookies. By using this site, these terms including the use of cookies are accepted. More explanation can be found in our Privacy Policy