04 Dec 2012
Intersil ISL8225M 30A Fully-Encapsulated Power Module
Analogue and mixed signal semiconductor provider, Intersil has introduced its ISL8225M 30A fully-encapsulated power module. The ISL8225M features a very high power density while also simplifying the design of high-performance board-mounted power solutions. Dual supply output
The Intersil ISL8225M can deliver up to 100W output power from a small 17mm square PCB footprint while being only 7.5 mm high making it ideal for many low profile boards and applications.
The two 15A outputs from the Intersil ISL8225M may be used independently or combined to deliver a single 30A output. When operated in parallel current sharing and phase interleaving allow up to six modules to be paralleled for 180A output capability. When used in this mode the phase interleaving enables very low levels of electromagnetic interference to be generated as well as providing a very low ripple output. There is a special current sharing connection on the chip that allows this operation to be effectively controlled.
Excellent efficiency and low thermal resistance permit full power operation without heat sinks or fans. The package provides directly connected pads to enable heat to be effectively removed, allowing the very high capability to be maintained, without additional cooling such as fans, etc. Additionally the output can be maintained up to 65°C.
The ISL8225M has an output range of 0.6 to 6.0V out and an input voltage range of 4.5 to 20V.
Designing a high-performance board-mounted power supply has never been simpler -- only a few external components are needed to create a very dense and reliable power solution. And the QFN package with external leads permits easy probing and visual solder inspection.
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