21 Dec 2012
TI Bluetooth software stack delivers over-the-air downloads
Texas Instruments has released its newest BLE-Stack 1.3 software to support continued development and enhancement of Bluetooth low energy.
The software includes over-the-air firmware downloads (OAD), which enable updates to CC2540/1 firmware to be downloaded from a central device, such as a phone, tablet or PC onto the CC2540/1 system-on-chip (SoC) directly over the RF link.
“The Bluetooth low energy market is rapidly expanding because of its ease of use and the innovative, unique applications being created to take advantage of Bluetooth v4.0-enabled smartphones and tablets. However, barriers to entry still remain,” said Sid Shaw, worldwide business development and marketing manager, Wireless Connectivity Solutions, TI. “Our new BLE-Stack 1.3 makes development with the CC2540/41 devices even easier through over-the-air firmware downloads, new interface support and increased tools functionality to help developers quickly get from concept to design.”
OAD support is said to help customers save time and simplify the software upgrade process, leaving more time to design and create new Bluetooth low energy devices and applications.
Additionally, for customers using Bluetooth low energy and proprietary implementations, TI’s unique Boot Image Manager (BIM) allows multiple firmware stacks to reside on a single CC2540/1 SoC. BIM enables an end-product to support two different Bluetooth low energy stacks or a single Bluetooth low energy stack and a single 2.4GHz proprietary stack.
The new software features are further supported by sample applications with extensive profile support and include upgraded network processor UART and SPI interfaces for improved power management control.
To further the development of new Bluetooth low energy applications, the new BLE-Stack 1.3 also runs on TI’s SensorTag development kit and Mini-kit.
The SensorTag development kit is supported by OAD, iOS app and the Bluetooth low energy device monitor.
Most popular news in Wireless technologyDNT 2.4GHz series wireless modules offer high-power at low-price
Microchip releases next-generation Bluetooth Low Energy solutions
Barcelona improves smart mobility system with CIPURSE
Communication DSPs address multimode connectivity requirements of IoT
Nordic Semiconductor enhances flexibility of protocol stacks
Share this page
Want more like this? Register for our newsletter