StarChip and CEA-Leti to drive Smart Card applications forward

Smart Card IC designer, StarChip, and French semiconductor research institute, CEA-Leti, have joined forces to develop a contactless front end for Smart Card applications including transport, banking and identity.

CEA-Leti will offer a wealth of knowledge on contactless technologies while StarChip will design the front end architecture and provide simulation tools.

“StarChip’s objective is to be a leading supplier for Smart Card market. The acquisition of Contactless technology and know-how from CEA-Leti is completing our technologies portfolio and will allow us to address all the Smart Card applications”, said Lucien Brau CEO and President of StarChip.

“We are glad to partner with very talented and experienced people from Leti to bring to the market tailored solutions to Smart Card customers’ requirements," he added.

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