21 Sep 2012
TriQuint unveils TRIUMF multi-band, multi-mode PA for smartphones
TriQuint Semiconductor has announced a new Multi-band, Multi-mode Power Amplifier (MMPA) that is said to simplify the increasingly complex RF front-end for next-generation global 3G / 4G smartphones and other mobile devices.
According to the company, the compact, highly integrated TRIUMF MMPA achieves best-in-class power-added efficiency, providing up to 15 percent more browsing time.
“As LTE networks roll out, next-generation smartphones have to incorporate a growing number of frequency bands. This means device manufacturers must support the rapidly growing RF content within very small form factors — without compromising performance,” explained Shane Smith, Vice President of Global Marketing for Mobile Devices. “Our new TRIUMF TQM7M9053 MMPA is optimised for these demanding applications. This integrated solution consumes 13 percent less PCB space than discrete components and simplifies routing to enhance system performance and time to market.”
Increasing device complexity is driving demand for integrated RF solutions such as MMPAs.
“Multimode, multiband PAs mark the rise of a new high-growth segment that will alter the course of the RF components industry,” said Christopher Taylor, an analyst with Strategy Analytics. He predicts that the market for MMPAs will reach more than $700 million in 2016. “The biggest opportunity for MMPAs is mid- to high-end smartphones, which use the largest number of bands and modes to ensure availability of voice and data services when roaming.”
TriQuint’s second-generation TRIUMF MMPA TQM7M9053 is drop-in, pin-compatible with the company’s TQM7M9023 MMPA, which, says the company, is found in some of the world’s most sought after smartphones and included on a leading chipset supplier’s reference design.
The 5 x 7.5mm MMPA offers quad-band GSM/EDGE and WCDMA/LTE bands 1, 2, 5 and 8 to support the 3G/4G market in North America, Europe and Asia.
Most popular news in Electronics componentsDedicated USB-to-UART Bridge IC Optimised for Android Platforms
TI introduces sensorless, brushless DC motor driver to spin motors instantly
Toshiba to mass produce 19nm NAND chips
EInk unveils three pigment electronic paper display
TriQuint delivers new GaN amplifers, transistors and processes