13 Feb 2014

Microsoft uses Cadence Tensilica processors in Xbox One

Cadence Design Systems has announced that Microsoft utilized four Tensilica processors in the Xbox One audio subsystem.

The subsystem was noted in the Linley Group Microprocessor Report entitled, “Inside the Xbox One Mega-SoC” .

“High-quality audio is a very important element to the overall gaming experience,” said Larry Przywara, director of audio/voice intellectual property (IP) marketing at Cadence.

“Microsoft selected Tensilica HiFi technology because of the strong audio codec ecosystem support, with over 100 software packages already ported and optimized for HiFi. Microsoft leveraged our customization technology to quickly create the optimal solution to meet their high-quality audio requirements,” he added.

Most popular news in Design principles

Design software slashes runtimes by 35%
Cadence Compiler speeds Renesas IP development
Microsoft uses Cadence Tensilica processors in Xbox One
Design boost for critical avionics systems
Altium and TI unveil WEBENCH power supply tools

All news in this channel | All news


Share this page


Want more like this? Register for our newsletter








Measuring up to the NB-IoT revolution Dr. Stamatis Georgoulis | Cobham Wireless
Measuring up to the NB-IoT revolution
There is a rapidly growing demand for making connections to all kinds of devices as the Internet of Things (IoT) starts to become a reality. Well over 10 different standards are already being proposed for these low-power machine-type communications (MTC) applications.
Whitepapers
Understanding 5G
Find out all about the current thinking and the technologies likely to be used for 5G. Be prepared . . read this informed and informative white paper.

More whitepapers










Radio-Electronics.com is operated and owned by Adrio Communications Ltd and edited by Ian Poole. All information is © Adrio Communications Ltd and may not be copied except for individual personal use. This includes copying material in whatever form into website pages. While every effort is made to ensure the accuracy of the information on Radio-Electronics.com, no liability is accepted for any consequences of using it. This site uses cookies. By using this site, these terms including the use of cookies are accepted. More explanation can be found in our Privacy Policy