27 Oct 2017

CEVA & LG Electronics Partner for Smart 3D Camera

CEVA has announced a partnership with LG Electronics to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications.

The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of 3D sensing applications.

These include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection, AR and VR. Computer vision experts from CEVA, Rockchip and LG worked closely together to optimize LG’s proprietary algorithms for the CEVA-XM4 using CEVA’s tool kit and optimized algorithm libraries ensuring optimal performance under stringent power constraints.

“There is a clear demand for cost-efficient 3D camera sensor modules to enable an enriched user experience for smartphones, AR and VR devices and to provide a robust localization and mapping (SLAM) solution for robots and autonomous cars,” said Shin Yun-sup, principal engineer at LG Electronics. “Through our collaboration with CEVA, we are addressing this demand with a fully-featured compact 3D module, offering exceptional performance thanks to our in-house algorithms and the CEVA-XM4 imaging and vision DSP.”

“We’re delighted to announce our collaboration with LG for the 3D camera module market,” said Ilan Yona, vice president and general manager of the Vision Business Unit at CEVA. Our CEVA-XM family of imaging and vision DSPs and software development environment allows companies like LG to deploy their in-house developed computer vision and deep learning technologies quickly and efficiently.”

CEVA’s latest generation imaging and vision DSP platforms address the extreme processing requirements and low power constraints of the most sophisticated machine learning and machine vision applications used in smartphones, surveillance, augmented reality, sense and avoid drones and self-driving cars.

These DSP-based platforms include a hybrid architecture composed of scalar and vector DSP processors coupled with a comprehensive Application Development Kit (ADK) to streamline software deployment.

The CEVA ADK includes: CEVA-Link for seamless software level integration with a host processor; a range of widely used and optimized software algorithms; the CEVA Deep Neural Network (CDNN2) real-time Neural Network software framework which streamlines machine learning deployment at a fraction of the power consumption of the leading GPU-based systems, and; state-of-the-art development and debugging tools.

By Ian Poole

Most popular news in Circuit Design

Cadence Allegro TimingVision speeds timing closure
Affordable PCB design tools introduced
Summer school encourages young engineers
Zuken’s CR-8000 Now Supported in SamacSys PCB Parts Libraries
Altium releases powerful upgrade to PCB design software

All news in this channel | All news


Share this page


Want more like this? Register for our newsletter






CPU choice for display based systems Rhett Evans | AndersDX
CPU choice for display based systems
Behind every display based system is the CPU which acts as the brain of the entire module creating the data that is presented as well as driving the I/O peripherals, display and touchscreen. There are many factors to consider when choosing the right CPU for your project, including whether you pick a complete Single Board Computer (SBC) or a stripped back core module (COM).
Training
Online - Effective Vector Network Analyzer Measurements
How to make effective VNA measurements at RF and microwave frequencies

More training courses

Forthcoming Events

    . . . . More Events









Radio-Electronics.com is operated and owned by Adrio Communications Ltd and edited by Ian Poole. All information is © Adrio Communications Ltd and may not be copied except for individual personal use. This includes copying material in whatever form into website pages. While every effort is made to ensure the accuracy of the information on Radio-Electronics.com, no liability is accepted for any consequences of using it. This site uses cookies. By using this site, these terms including the use of cookies are accepted. More explanation can be found in our Privacy Policy