11 Jul 2014
M/A-COM unleashes latest GaN power modules
M/A-COM has announced the newest entry in its portfolio of GaN in Plastic power module products.
Optimized for pulsed Avionics applications in the 960 to 1215 MHz band, MACOM’s new 2-stage, fully matched GaN surface mount power module scales to peak pulse power levels of 100 W in a 14 x 24 mm package size.
MACOM’s new high gain GaN in Plastic power modules support surface mount technology (SMT) assembly, providing significant cost and process advantages compared to ceramic-packaged flange-mount components.
Delivering clear benefits in size, weight and power (SWaP) while enabling high volume manufacturing efficiency, the GaN power modules feature a Land Grid Array (LGA) pattern for enhanced thermal flow and “True SMT” assembly and do not require copper coining or complicated thermal management techniques on the system PC board.
Under pulsed conditions, these modules deliver output power greater than 90W, with 30 dB a typical associated power gain and 60% typical power added efficiency.
Supporting 50V operation and up to 3 ms pulse width/duration for improved signal flexibilty, the power modules reduce overall power consumption and cooling requirements compared to existing options.
“The 90 W Avionics module is the latest GaN Module in MACOM’s growing family of fully matched SMT power products,” said Paul Beasly, Product Manager, MACOM. “The ease of application, system benefits and surface-mount automated assembly are of great benefit to the customer, and critically, also improve the time to market for rapidly evolving requirements in aviation and radar applications.”
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